Industry News | 2021-01-21 08:14:35.0
Seika Machinery, Inc. introduces the SC-BP3 Multi-Purpose Bubbling Cleaning System. The system cleans tough and stubborn flux five times faster than immersion cleaning.
New Equipment | Cleaning Agents
KYZEN E5321-LF is a room temperature pallet and maintenance cleaning agent specifically designed to remove flux residues from wave solder pallets, reflow oven filters, spray nozzles, air bubbling diffusion bars, and other assembly hardware used to so
New Equipment | Coating Equipment
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New Equipment | Solder Paste Mixers
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Industry News | 2013-01-22 01:29:07.0
Fuji has released the NXTP M35 printer, which expands the supported panel size of this printer series to 350 x 300 mm (13.7 x 11.8 inches). The latest addition to the Fuji line-up has all the benefits of the previously released NXTP M25, but with a wider body for handling medium sized panels.
