Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2024-06-06 21:18:44.0
Heller Industries announced two hirings today to strengthen their market position in the Eastern United States. Bob Doetzer, President of Circuit Technology Inc., has been appointed sales representative for North and South Carolina. Circuit Technology is a manufacturer's representative and IPC training group specializing in products and services covering circuit board production and semiconductor assembly.
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2019-12-09 11:43:15.0
Whizz Systems, Inc. invites you to join them on Wednesday, January 15, 2020 at their facility in Santa Clara, California (USA) for a complimentary and educational Lunch & Learn. The event is in cooperation with the SMTA Silicon Valley Chapter.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
