Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-04-01 08:40:24.0
Using environmentally safe solvents these machines offer two-stage, multiple-frequency ultrasonic cleaning, rinsing and drying for pcb defluxing, cleaning of precision parts and metal degreasing.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2021-11-22 07:27:39.0
MIRTEC is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Inspection – AOI systems for its MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2015-08-24 14:59:01.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #407 at SMTA International, scheduled to take place Sep. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the latest advancement MIRTEC’s award-winning 3D AOI and SPI systems during the two-day event.
Industry News | 2018-10-15 18:51:46.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System and MS-11e 3D SPI Machine at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara.
