Industry News | 2019-04-10 10:19:18.0
(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.
Industry News | 2019-07-15 14:35:27.0
(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2017-06-06 10:38:43.0
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2017-06-13 09:00:37.0
YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2018-01-16 10:40:31.0
Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160
Industry News | 2018-02-08 09:25:01.0
IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732
Industry News | 2018-02-14 10:19:15.0
Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials
Industry News | 2018-02-14 10:21:37.0
Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials
Industry News | 2018-03-30 15:21:31.0
Visit YINCAE at Booth #5269
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