Industry News | 2009-05-07 14:57:37.0
�At the beginning of this new financial year, Henkel too has felt the effects of the persistently adverse economic climate, with our businesses turning in a very mixed set of results for the first quarter of 2009,� commented Kasper Rorsted, Chairman of the Henkel Management Board. �Our two consumer goods business sectors, Laundry & Home Care and Cosmetics/Toiletries, continued to perform very well, while the Adhesive Technologies business sector suffered from the challenges encountered in major customer industries worldwide.� Rorsted continued: �We are dissatisfied with our start to fiscal 2009. However, we are convinced that, as a result of our early introduction of countermeasures and based on our solid financial position, we will emerge from this still difficult economic environment stronger than before.�
Electronics Forum | Thu Mar 13 09:23:26 EST 2003 | jrloudenjr
What types of systems/procedures are normally used or followed to allow for scrap percentages typically from a 43,000cph placement machine.
Electronics Forum | Fri Jun 26 19:02:09 EDT 1998 | Rin Or
I am very interesting of getting information about the criteria inspection of BGA. Example, what are percentage allowance for void, solder joint volume etc.. Any information feed back will be greatly appreciated.My factory just install the Nicolet NX
Electronics Forum | Fri Jul 10 14:26:17 EDT 1998 | Bob Willis
There is a FREE yes Free inspection standard on my web site you can download. There is also information on my CD ROM, posters and video for BGA Inspection http://www.bobwillis.co.uk | | I am very interesting of getting information about the criteria
Electronics Forum | Tue Jul 07 03:34:06 EDT 1998 | Martin Kelly
Hi just to let you know, in case you don't, but an x-ray machine is needed too check the solder balls, once they've been placed. See you later, | | I am very interesting of getting information about the criteria inspection of BGA. Example, what are
Electronics Forum | Fri Mar 04 18:28:21 EST 2011 | hegemon
First, I would inspect for lack of solder bridges from the center slug to the outside leads. I would then look for evidence that the solder paste has reflowed beneath the component, without leaving too much void percentage. Typically we allow up
Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
Electronics Forum | Mon Dec 06 00:22:41 EST 1999 | Greg H
Hi All, I have this problem sorting out the percentage of allowance that we need (per component) for our SMT machine attrition rate. When you say 1%. Say I have a PCB with 3 types of SMD components, type X is using 30 components, type Y is using 5
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
