Electronics Forum | Tue May 24 18:20:05 EDT 2005 | gregcr
Hi All, I am looking for a supplier for the hardware used on reflow SMT carrier pallets. I know that there are many vendors who can make the pallets themselves, but where do they get the locator pins or spring clips. I'm not sure if each vendor ju
Electronics Forum | Thu Nov 08 06:12:03 EST 2007 | mattkehoe
Can someone point us in the right direction? We are trying to find a formula to determine the "cubic mils" of solder we end up with after reflow. (No components during the reflow) Some of the discussions we've had about it produced the thoughts bel
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Wed Sep 10 12:44:55 EDT 2008 | vladig
Well, it wasn't as easy to figure out the root cause. The last image is below. It shows how the board finish looks like (the trace was under solder mask). AS you can see, the layer of E-Ni is spliting (the board shop admitted the problem afterwards).
Electronics Forum | Fri Jun 12 13:06:14 EDT 2009 | grizzy
We have an excellent machine from a leading manufacturer of Conformal Coating equipment..... USI. This machine can run relatively high volume applications, and is in line, smema controlled. I suggest you watch the video of our machine in operation, a
Electronics Forum | Tue May 15 13:08:53 EDT 2012 | deanm
Dittos from A Very Frazzled Man. Money spent on a better process is almost always more advantageous than better inspection. As for manual TH insertion, have you considered a semi-automatic machine like the Contact Systems CS-400? While the "E" serie
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Thu Nov 07 15:33:02 EST 2013 | mleber
Below are a few photos of an ongoing issue we are having with 1 pwb style. Some of the pads appear to have contamination that appears after the selective solder step. The joints are extremely hard to rework - almost impossible. We had the joints anal
Electronics Forum | Wed Nov 26 11:53:53 EST 2014 | philc
Reckon on around 2% of wasted parts for each and every component used, and you won't be too far off. Decide on a value below which you don't care, and for parts that cost more than that, you need to keep a closer eye on them to see if they are indee
Electronics Forum | Sat Jan 09 01:30:36 EST 2016 | junax
Thanks for your input Michael. Basically the boards had been go through from washing and even ionic contamination already. In order to eliminate or detect the flux residues, is there any equipment something like a uv lamp that can detect the flux fro
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