Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener
I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind
Electronics Forum | Fri Oct 03 10:24:17 EDT 2008 | chineechooze
I have a problem with placement repeatability and accuracy on this Samtec connector. The customer wants to use a "nubbed connector" which has to be placed in the corresponding PCB holes. When the nubs miss the holes, the part becomes "lifted." SEE
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Thu Feb 21 10:11:36 EST 2013 | patrickbruneel
The backflow in the wave started to become very important with the development of no-clean/no residue fluxes. These fluxes don’t have (or at least shouldn’t have) rosin, resin or other vehicles in the formulation which encapsulate surface oxides from
Electronics Forum | Wed Jun 12 13:27:28 EDT 2013 | joeherz
Our customer wants to do an overmold operation (3rd party to us) on the non-populated side of a rigid flex assembly. Their inquiry below: "We are going to end up over molding plastic over the back of this rigid flex to form an enclosure but wanted
Electronics Forum | Thu Jul 09 22:45:42 EDT 2015 | cathy247
Hello Maxim, we offer below services with Popular Competitive Pricing: －Express PCB Prototyping(2-28 layer) －HDI PCB －Flexible Printed Board(1-8 layer) －Flexi-rigid Printed Board －High Frequency Board(Rogers,Arlon,PTFE) －Blind/Buried Via Board －High
Electronics Forum | Wed Jan 13 12:17:47 EST 2016 | trampacorp
Thanks for your input Michael. Basically the > boards had been go through from washing and even > ionic contamination already. In order to > eliminate or detect the flux residues, is there > any equipment something like a uv lamp that can > dete
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