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Help required selecting reflow oven

Electronics Forum | Thu Jun 27 03:03:57 EDT 2019 | SMTA-David

Hi, I have a small assembly line that consists of a Semi-Automatic Stencil machine, a Samsung Pick and Place, a small IR reflow oven and a wave soldering machine. The reflow oven is presenting the biggest bottleneck. The machine is a small IR (T960

Re: solder balling

Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.

If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo

Fine Pitch Pad Width Size VS Component Lead Width

Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper

Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis

So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free

Re: Serial Numbering of PCB's (?)

Electronics Forum | Thu Feb 03 11:20:15 EST 2000 | John O'Brien

This is getting to be a more common practice, especially with the application of a 2-D bar code directly to the board (via laser, ink jet,etc.) Some really major companies are jumping on the bandwagon because it also allows treating each board as a l

Re: Wave soldering smt components

Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau

Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Re: Where can I purchase a PCB with a bare copper grid for solder flux evaluations.

Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F

| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz

Re: Shelf Life of Assemblied PCB's

Electronics Forum | Tue Aug 03 13:03:20 EDT 1999 | Dave F

| | I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone know of

Re: Shelf Life of Assemblied PCB's

Electronics Forum | Tue Aug 03 13:03:48 EDT 1999 | Dave F

| | I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone know of


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