Electronics Forum | Fri May 07 02:29:16 EDT 1999 | Bob Willis
| | I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | | | PROBLEMS | | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometim
Electronics Forum | Sat May 01 04:49:21 EDT 1999 | Jeff Sanchez
| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad
Electronics Forum | Sun Apr 18 19:18:28 EDT 1999 | Wayne Bracy
| | | | Please visit our Web site, especially 'link page', to get some hint for roll typr of cleaning wiper for automatic screen printers. http://www.squeegee.co.kr | | | | | | | Idiot: I wouldn't visit your site if I had to start using toilet pap
Electronics Forum | Wed Jan 27 23:29:28 EST 1999 | parag palshikar
| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Oct 23 18:13:53 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Electronics Forum | Wed May 20 07:24:18 EDT 1998 | Earl Moon
| Hey there ya'll... | I was reading the messages from Earl asking where he could upload some articles he wrote, and I was asked how one goes about putting a image in the messages here... | Ya'll see down at the bottom where it says; "Option
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Wed Sep 10 11:57:14 EDT 2003 | Mike Konrad
First, you must determine a few things: 1. What specific de-fluxing chemical are you going to use? Basic required determinations include the chemical�s pH, is it a VOC (if so, what is its VOC content), what concentration is the chemical used in (1
