Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com
Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel
Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.
Electronics Forum | Wed Feb 03 20:26:49 EST 2010 | mika
Hi, First: 1. What os/system? 2. what s/w version? 3. what type of machine model? 4. What type of head configuration? 5. Do you have this head front or back? 6. Do you have encounter this problem before? 7. Have you recently placed any new "high com
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Wed Sep 04 10:10:10 EDT 2019 | jameshoward
I know exactly what your problem is as I have seen it many times. Your problem is with indexer 1 (the cylinder which runs up and down and actuates feeders on side 1). At each end of the travel of the indexer is a micro switch hidden down below the be
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Fri Oct 09 15:06:22 EDT 1998 | Chrys
Dave F asked me for an update on the SRS we evaluated last month... I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration method mu
Electronics Forum | Fri Oct 09 16:33:08 EDT 1998 | Dave F
| Dave F asked me for an update on the SRS we evaluated last month... | | I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration met
