Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2022-05-05 17:43:39.0
MacDermid Alpha Electronics Solutions will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
Industry News | 2023-11-20 13:47:24.0
MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.
Industry News | 2022-08-26 09:48:19.0
MacDermid Alpha Electronics Solutions will exhibit its range of innovative assembly solutions for the electronics manufacturing services industry at the upcoming EMS-Tag conference and exhibition on Thursday 8th September in Würzburger, Germany.
Oriental Motor USA Corp.
Industry News | 2001-11-20 17:20:21.0
From Oriental Motor USA Corp
Industry News | 2020-09-06 04:53:14.0
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
Industry News | 2020-09-10 11:09:50.0
MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
Industry News | 2021-03-06 03:21:15.0
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
Industry News | 2021-03-31 17:56:27.0
MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.
