Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Industry News | 2020-11-06 17:27:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Industry News | 2021-12-13 12:52:59.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Industry News | 2013-02-25 16:44:53.0
MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing.
Industry News | 2021-08-13 08:27:45.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: "The Interaction of Two Solder Paste Alloys With 5 Surface Finishes"attheSMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.
Industry News | 2019-10-02 13:53:10.0
10.03.2019 – Atlanta – Koh Young America proudly introduces its latest True 3D Automated Optical Inspection (AOI) platform – the Zenith Alpha. Driven by the increasing need to inspect and measure densely populated boards at faster speeds, Koh Young leveraged its award-winning and proven technologies to deliver a new solution. The Zenith Alpha is suitable for myriad manufacturers, including smaller companies just realizing how 3D measurement can improve the board assembly process yield.
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2024-04-08 14:13:51.0
Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju's infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.
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Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.
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