Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
Electronics Forum | Tue Apr 29 15:45:09 EDT 2003 | davef
We have mixed bar solder from alternate suppliers in our wave soldering machine. Issues that you need to address before changing your solder supplier are: * Assure that the alloys are the same. In this, consider imaginative people may be reporting
Electronics Forum | Fri Jul 16 22:49:55 EDT 1999 | Vic Lau
| We intend to use VOC free fluxe in our nytro machine. Does anybody know if there can be problems with water ie. solvent residues in the tunnel. Perhaps there are some white papers available on that issue. | | | | | Dear Raeto, In my experienc
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
Electronics Forum | Thu Apr 08 04:52:24 EDT 2004 | Dougie
We are concerned about the issues you mentioned and more, however we have no option but to change over due to legislation. A high percentage of our market share is in Europe and Japan, who of course have already embraced the no-lead change. We simply
Electronics Forum | Tue Apr 18 10:42:27 EDT 2006 | Carol Stirling
Hello All, Could someone offer suggestions to cure poor BGA reflow that is limited to the same area of the BGA and on one type of board only. The reflow has the look of "baseball caps" and is positioned such that it is the leading edge only that doe
Electronics Forum | Mon Apr 23 14:05:07 EDT 2007 | Cmiller
Dave, we have the same issue running a new bare board through the oven with no paste. If there is an imcompatibility with our flux would it still manifest itself when there is not flux? Im sure there is some residual flux in the oven all the time. We
Electronics Forum | Thu Jan 10 11:37:43 EST 2008 | jdengler
Hi JD, We use the OM-310 NC for most of our lead free work and see some wetting issues. We also have a lead free produst that requires cleaning so we use the WS-819. It does seem to wet better although I have never tried the WS-819 on the same b
Electronics Forum | Tue Jan 15 11:50:17 EST 2008 | pbarton
We too are trialling WS819 with SAC305 alloy. The foaming in cleaning causes us a headache but all other attributes seem much improved over earlier types. Previously we were using WS619 - no foaming issues but MUCH shorter stencil life (less than 4 h
