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MIRTEC Europe Expands into New Facility that Better Meets Customer Needs

Industry News | 2013-01-21 11:15:30.0

MIRTEC, announces the opening of a new manufacturing facility in Europe to further strengthen business and local support.

MIRTEC Corp

Teradyne Introduces Optima 7210 Optical Process Test 'OPT' System

Industry News | 2003-04-02 09:03:49.0

Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation

SMTnet

DDi Corp To Move From Nasdaq Small Cap Market To Over The Counter Bulletin Board

Industry News | 2003-04-14 09:02:03.0

The stock will be eligible to trade on the Over the Counter Bulletin Board (OTCBB) under the ticker symbol �DDIC� as early as April 15, 2003, provided a market maker enters a quote for the security.

SMTnet

AeA Expands Micro Cap Financial Conference to Web to

Industry News | 2003-04-14 09:17:40.0

AeA Micro Cap Virtual Conference to be held Online May 16th

SMTnet

Introducing Monarch Technologies Group: EDA Sales Force for Hire

Industry News | 2003-04-21 10:09:08.0

New Sales, Marketing Channel for Emerging EDA Companies

SMTnet

CirTran New Business Orders Exceed $1 Million

Industry News | 2003-06-09 08:37:23.0

his figure does not include additional revenues from shipments against orders booked in prior periods.

SMTnet

MIRTEC TO BRING 3D AOI AND SPI INSPECTION SYSTEMS TO PRODUCTRONICA

Industry News | 2013-10-08 15:37:23.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

MIRTEC Corp

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet


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