Parts & Supplies | Assembly Accessories
1-417-515-11 alternative CCD Camera for F130WK XC-HR50 141751511 Sony spare parts: 4-702-755-01 4-702-721-03 4-702-692-02 4-702-694-02 x-4700-016-2 x-4700-023-3 4-702-747-02 4-702-840-03 x-4700-102-1 4-719-894-71 4-721-707-01 4-722-644-11 4-702-
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Events Calendar | Wed Mar 03 00:00:00 EST 2021 - Wed Mar 03 00:00:00 EST 2021 | ,
Are Humidity Indicators Part of Your Supply Network?
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzle Used on CM202/301/402/602 110,115A,120,130,140,450, 205A,1001,1002,1003,1004, 1005,1006,110S,115AS,120S, 130S,140S,230CS,230C, 235CS,225C Part Number Alternative Description KXFX03DGA00 W1BCA CM202/402 NOZZLE TYPE: 110
Parts & Supplies | Pick and Place/Feeders
Long board SMT Placement Machine JX-350 Chip 32,000CPH chip (Laser centering/Optimum) 21,000CPH chip (Laser centering / IPC9850) ■ From 0603 to □33.5mmsquare components ■ JUKI laser centering for high spe
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Used SMT Equipment | Pick and Place/Feeders
Device parameters Paste head: 2 Paste heads(simultaneously adsorbed alternately) Mounting accuracy: ± 0.03 mm/chip(when laser recognition) ± 0.09 mm / QFP(when laser recognition) Paste speed: 0.32 seconds / CHIP, 1.8 seconds QFP) B
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Used SMT Equipment | AOI / Automated Optical Inspection
SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning
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