Parts & Supplies | Chipshooters / Chip Mounters
39a nozzle yamaha ASSEMBLEON - YAMAHA TYPE 35 MELF (R-0.75) Part Number:A35MF-075R 32-1 WITH REFLECTOR Part Number:5322 360 10199 Alternative Part #'s KMO-M711B-DIF-NA. 32 Part Number:9466 029 62721 31 WITH SPRING Part Number:KMO-M711A-02XSP 39
Parts & Supplies | Chipshooters / Chip Mounters
35a nozzle yamaha 35a nozzle yamaha ASSEMBLEON - YAMAHA TYPE 35 MELF (R-0.75) Part Number:A35MF-075R 32-1 WITH REFLECTOR Part Number:5322 360 10199 Alternative Part #'s KMO-M711B-DIF-NA. 32 Part Number:9466 029 62721 31 WITH SPRING Part Number
Parts & Supplies | Chipshooters / Chip Mounters
Yamaha Assembleon FCM ASSEMBLEON FCM MELF Part Number:5322 479 60114 Assembleon FCM TiN Coated Nozzle for Melf components. Alternative Part #'s PA2747/50. ASSEMBLEON FCM LARGE Part Number:9466 027 47301 Assembleon FCM TiN Coated Nozzle Large with 1
Parts & Supplies | Pick and Place/Feeders
High-Speed Matrix Tray Server (Rear type) TR7D Rear mount tray server presents entire trays to the machine for direct picking (no intermediate shuttle hand off). ■ Ideal for odd shaped components or ones with bottom side features that make shuttle
Parts & Supplies | Pick and Place/Feeders
Long board SMT Placement Machine JX-350 Chip 32,000CPH chip (Laser centering/Optimum) 21,000CPH chip (Laser centering / IPC9850) ■ From 0603 to □33.5mmsquare components ■ JUKI laser centering for high spe
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Used SMT Equipment | Pick and Place/Feeders
Device parameters Paste head: 2 Paste heads(simultaneously adsorbed alternately) Mounting accuracy: ± 0.03 mm/chip(when laser recognition) ± 0.09 mm / QFP(when laser recognition) Paste speed: 0.32 seconds / CHIP, 1.8 seconds QFP) B
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Automotive Electronics Webinar
