Parts & Supplies | Pick and Place/Feeders
Long board SMT Placement Machine JX-350 Chip 32,000CPH chip (Laser centering/Optimum) 21,000CPH chip (Laser centering / IPC9850) ■ From 0603 to □33.5mmsquare components ■ JUKI laser centering for high spe
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Used SMT Equipment | Pick and Place/Feeders
Device parameters Paste head: 2 Paste heads(simultaneously adsorbed alternately) Mounting accuracy: ± 0.03 mm/chip(when laser recognition) ± 0.09 mm / QFP(when laser recognition) Paste speed: 0.32 seconds / CHIP, 1.8 seconds QFP) B
Used SMT Equipment | AOI / Automated Optical Inspection
SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Automotive Electronics Webinar
Industry News | 2012-04-06 16:02:03.0
When a component manufacturer discontinues a particular component, it creates a ripple effect throughout the electronics assembly industry, leaving EMS providers with myriad critical questions to answer.
Used SMT Equipment | Pick and Place/Feeders
Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra
Used SMT Equipment | Pick and Place/Feeders
Hitachi Mounter SIGMA G5 Features: SIGMA G5 models can be mounted spotlights television sets, LED lamp shade, and is the only ultra-fast, turret structure mounted transparent lamp placement machine! Hitachi SIGMA G5 parameters Mounting head st
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