Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Industry News | 2009-12-07 19:48:02.0
Techcon Systems invites visitors to Productronica 2009 to ‘TAP’ into Techcon Systems ‘Training’, ‘Application’ and ‘Productivity’ advantages with an impressive line up of the latest cost-saving fluid dispensing solutions. A leading global supplier of fluid dispensing systems and accessories, Techcon Systems will exhibit alongside Metcal and Oki branded products on the OK International Stand 127, Hall A4 at the bi-annual event, which is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany. German companies will also be able to discuss Techcon Systems products at the show with German partner Globaco.
Industry News | 2009-12-07 18:54:01.0
EAST WINDSOR, CT — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, will feature its leading range of environment-friendly products and ESD safe wiping rolls in Hall A2 booth 535 at the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-03-24 14:20:57.0
RANCHO CUCAMONGA, CA - Aqueous Technologies Corp. announces that it will feature its Trident III and Trident Duo automatic defluxing and cleanliness testing systems, along with its Zero-Ion G3 and StencilWasher-ECO technologies in booth 725 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Electronics Forum | Thu Jan 24 11:30:16 EST 2013 | davef
I'm not aware of a solder paste solvent. What do hope to accomplish with such a material? May be we can suggest an alternative.
Electronics Forum | Fri Nov 12 05:14:42 EST 1999 | S L CHANG
We are currently cleaning solder paste (TAMURA SQ-1030FP) from stencil using an ultrasonic stencil cleaner with solvent (HYSPER-Non CFC). The process cycle time is 30 sec. cleaning in 1st ultrasonic tank and another 30sec. cleaning in 2nd ultrasonic
Electronics Forum | Tue Dec 22 12:08:06 EST 2015 | aqueous
The overwhelming technology used in post-reflow cleaning of electronic assemblies is aqueous. Prior to the 1990's, solvents and vapor degreasers dominated the cleaning industry. After the popular solvents were banned via a United Nations treaty, alte
Electronics Forum | Thu Mar 11 11:04:43 EST 2004 | Sam
We are looking at reviving our vapour degreasing process. But before we do, does anyone have any suitable knowledge of vapour degresing solvents as an alternative to Tricholorethane and Arklone etc ? Any feedback regarding this process would be muc
Electronics Forum | Tue Jul 13 01:00:03 EDT 2004 | Shean Dalton
Cleaning RMA fluxes simply requires selecting a washing chemistry (either Solvent, Semi-aqueous or Aqueous) and an appropriate cleaning sytem. Your lot size would be easily handled with a batch system. visit http://www.aat-corp.com/Technical/Def
Electronics Forum | Mon Feb 13 10:33:57 EST 2006 | fredericksr
Hello, I am automating a process on our floor from wire solder hand application to dispensed paste and reflow. The process involves "lidding" a shielding lid around our assemblies for microwave quieting. The result is non-hermetic. For cosmet
