Parts & Supplies | General Purpose Equipment
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New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Mon Oct 10 20:06:59 EDT 2005 | nuezmaster
Does anyone have any experience running Aluminum Electrolytic Caps with a SAC305 alloy. The profile for the solder calls out a peak temp of 235-255C and 60-75 seconds above 217C. Most can cap manufacturers are calling out for 230-245c max for no lo
Electronics Forum | Mon Dec 19 07:55:30 EST 2016 | bk
I am assuming that these are the round aluminum electrolytic caps. The problem may be that they are too wide to put on 2 hydra heads next to each other. Plus the hydra heads are not that great at placing tall parts. I would not let the hydra place th
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