Full Site - : aluminum electrolytic cap corrosion (Page 1 of 3)

Panasonic 400V 100uf electrolytic cap

Panasonic 400V 100uf electrolytic cap

Parts & Supplies | General Purpose Equipment

CD294 105C Snap in electrolytic capacitor CD294 Series Snap in aluminum electrolytic capacitor, 105C Standard Snap in aluminum electrolytic capacitor, CD294 105C Standard aluminum electrolytic capacitor Manufacture Supply CD294 Series 105C Standard

Shanghai Imax Electronic Co.,ltd

Panasonic 450V 6800uf electrolytic cap

Panasonic 450V 6800uf electrolytic cap

Parts & Supplies | General Purpose Equipment

CD139 5000Hours Large Can electrolytic capacitor CD139 Screw aluminum electrolytic capacitor, CD139 5000 Hours Screw aluminum Electrolytic capacitor, Professional Power Screw aluminum electrolytic capacitor Manufacture Supply CD139 Series 5000 Hou

Shanghai Imax Electronic Co.,ltd

Panasonic 450V 4700uf large can cap

Panasonic 450V 4700uf large can cap

Parts & Supplies | General Purpose Equipment

CD137 85C Stud electrolytic capacitor CD137 Screw aluminum electrolytic capacitors, CD137 large can aluminum electrolytic Capacitor, Professional Inverter aluminum electrolytic capacitor, Manufacture Supply CD137 Series 5000 Hours 85C long life La

Shanghai Imax Electronic Co.,ltd

TTC100C - Lead Free Tip Tinner

TTC100C - Lead Free Tip Tinner

New Equipment | Solder Materials

Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic

FCT ASSEMBLY, INC.

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Reflowing large aluminum electro. caps

Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf

I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t

Alum Electrolytic Caps

Electronics Forum | Mon Oct 10 20:06:59 EDT 2005 | nuezmaster

Does anyone have any experience running Aluminum Electrolytic Caps with a SAC305 alloy. The profile for the solder calls out a peak temp of 235-255C and 60-75 seconds above 217C. Most can cap manufacturers are calling out for 230-245c max for no lo

MYDATA - how to forse parts on Hydra head

Electronics Forum | Mon Dec 19 07:55:30 EST 2016 | bk

I am assuming that these are the round aluminum electrolytic caps. The problem may be that they are too wide to put on 2 hydra heads next to each other. Plus the hydra heads are not that great at placing tall parts. I would not let the hydra place th

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

IR oven profiling

Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger

Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi


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