Industry News | 2016-04-18 11:31:46.0
Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.
Industry News | 2015-12-13 21:07:44.0
Sono-Tek Corporation is proud to announce the sale of its 4,000th fluxer to Jabil Circuit Inc. This milestone was achieved in Sono-Tek’s 40th year in business.
Industry News | 2023-07-19 09:24:50.0
SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.
Industry News | 2020-07-22 04:54:01.0
Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2016-02-16 20:18:38.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2016-03-22 16:57:05.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Industry News | 2016-03-23 20:19:20.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
