Electronics Forum | Mon Jul 23 20:18:18 EDT 2001 | davef
Prasad�s book, that an earlier poster mentioned, is good, but other books to consider are: * MacLeod Ross �Guide Design & Manufacturing V1 & V2� Electrochemical Publications * Wassink & Verguld �Manufacturing Techniques For Surface Mount Assembly� El
Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper
Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Thu Mar 01 10:46:11 EST 2001 | davef
Various lint free stencil wipe suppliers take various approaches to stencil cleaning. For instance ... Techspray Directions: Start with a dry TechClean Wipe (2358, 2361, or 2362) to remove excess solder pastes. Follow this with the 1608 Pre-Saturat
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Tue Jul 20 12:49:38 EDT 2004 | mmjm_1099
We are having a problem with our Heller 1800W oven with certian parts skewing. It seems that some inductors and taller Can caps are shifting around in the oven. It seems it will solder fine and than all of a sudden just be off to one side or the othe
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic