Electronics Forum | Wed Aug 08 21:18:15 EDT 2001 | davef
Get-out the razor blades, bud. You could run that sukka for 6 sec dwell, cook breakfast on it, and you still will not get fill. [Hole file that is, breakfast will go along ways if peckish, though.] You could fire-up the depleted ozone rework gun [
Electronics Forum | Tue Oct 06 17:17:44 EDT 1998 | Chrys
| We are experiencing poor wetting on various components placed on a PCB with En-Tek coating. Is anyone else experiencing simular problems ? We have the following questions: | | 1. How can the thickness of the En-tek coating be measured? | 2. Is En
Electronics Forum | Wed Oct 13 13:47:02 EDT 1999 | John Thorup
Jeff In my experiance the main problem is the flux content of the paste (up to 50%). throwing it in the wave pot results in a big stickey ring around the pot, a lot of smoke and, as Brian says, a lot of dross. A fire is not that unlikely! I tried
Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon
| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall
| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
