Industry News | 2018-05-16 19:57:33.0
SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.
Industry News | 2018-05-20 18:31:27.0
SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2018-09-18 20:19:23.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.
Industry News | 2021-08-05 16:18:56.0
Mallory Sonalert Tantalum Capacitors Demonstrate Resistance to Shock, High Temperature, and Vibration; Ideal for Consumer and Military Applications
Industry News | 2018-10-22 18:35:12.0
SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.
Industry News | 2018-11-26 17:44:57.0
Feeder Finger announced the release of their embossed tape Finger for its key partner, Juki Automation Systems. Due to market demand, the teams at both Feeder Finger and Juki collaborated to design, build and test a finger specifically made to handle embossed tape. This product expansion is expected to garner pre-orders at SMTA International with full production available in November 2018.
Industry News | 2021-10-11 16:08:26.0
SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.
Industry News | 2019-01-05 16:26:04.0
SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
Industry News | 2022-01-10 16:49:36.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
