Industry Directory | Manufacturer
1-20 layers PCB manufacturer, focusing on metal core pcb, multi-layer PCB, fast PCB and middle-small batch PCB. Min. circuit width & spacing: 3mil. UL, ISO9001, ROHS,ISO14001 certified.
Industry Directory | Manufacturer
PCB boards from High Tg/Polyimide/Rogers/Hybrid and Thermally Conductive/Metal Core materials up to 18 layers with blind/buried vias & fine lines. Panels to 24x24
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
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New Equipment | Rework & Repair Equipment
The model SV560 is has a high resolution optical system for placement of components as small as 1mm. With it's rapid heat infrared area heater it can rework boards as large a 36" and 36 layers. High Resolution HDMI Vision System Fits Boards up t
Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob
Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere
Electronics Forum | Thu Jul 06 16:13:28 EDT 2017 | barryg
Hello everyone, I was curious if anyone knows what criteria there is for layer to layer registration. I have looked at ipc-600 and 601 and have not found anything or am missing something. We had a small qty. of pcbs sent to a customer and some inner
Used SMT Equipment | AOI / Automated Optical Inspection
This item is part of our online equipment auction happening right now. The bidding for this auction begins closing on Thursday, 12/9, at 1pm EST. Click the following link to view more photos and details: https://bajabid.hibid.com/lot/107722753
Used SMT Equipment | SMT Equipment
Product Name: FX-2 high speed modular chip mounter Product number: FX-2 Detailed product introduction Characteristic： Mount work efficiency is increased by 20%, *1 at the same time to make economic benefits, operating performance, reliability of
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Parts & Supplies | Pick and Place/Feeders
GFC-J01 JUKI Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the cart is m
Parts & Supplies | Pick and Place/Feeders
GFC-J01 JUKI Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the cart i
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2013-09-19 17:25:32.0
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation...
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | San Jose, California USA | Management
DCSI is one of the most trusted and respected global executive search and solutions companies inthe electronics manufacturing industries. We have more than 35 active openings that range from Managers, Directors, Sr. Directors, Vice Presidents, to EV
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express September 19, 2013, Subscribers: 26298, Members: Companies: 13483, Users: 35191 Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any Layer Manufacturing Technologies by Gerhard Schmid, Martin
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html
QFN Thermal Via Pitch - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login QFN Thermal Via Pitch
