Industry Directory | Manufacturer
When you purchase from Avanti you are dealing directly with a US based manufacturer with full in house capabilities and a management staff with over 200 years of combined PCB manufacturing experience.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Wed Mar 21 10:37:02 EDT 2012 | torch
we are currently developing a 180 degs downhole tool and are right at the limits of our current solder paste, the tool has mostly surface mount parts and some fine pitch ic's. i was wondering if anyone had any recomendations for a suitable solder pas
Used SMT Equipment | Pick and Place/Feeders
We have an immediate need for Mydata My100, MY200 and My300 SMT Pick & Place machines. Any model year is acceptable.
Used SMT Equipment | Pick and Place/Feeders
More information:https://bajabid.com/product/2014-mycronic-my200sx-14/ This machine is avalable for immediate purchase. Please contact us with any interest. (813) 992-2437.
Industry News | 2003-01-31 09:39:08.0
Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Parts & Supplies | SMT Equipment
PANASONIC DRIVER Panadac LA321002-2 KXFP6GB0A00Y AXIS MOTOR DRIVER MR-J2S-100B-EE085 KXFP6GE1A00X AXIS MOTOR DRIVER MR-J2S-40B-EE085 KXFP6F97A00Y AXIS MOTOR DRIVER MR-J2S-70B-EE085 N510002594AAY AXIS MOTOR DRIVER MR-J2S-350B-S041U703 N51000
Parts & Supplies | SMT Equipment
SAMSUNG CP40 I-F board J9060023B SAMSUNG CP40 CP45 CP50 TRAY COVER BRACKET J7052596B SAMSUNG CP40 CP45 CP50 DOUBLE UNION UWD06-04 J6711166A - (0.00) SAMSUNG CP40 CP45 CP50 TEE FITTING KQ2T08-06 J6711145A - (0.00
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
Panasonic NPM-W2 Modular SMT Chip Mounter Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,
Continued Journey of Equality Expo
Events Calendar | Wed Mar 13 00:00:00 EDT 2019 - Thu Mar 14 00:00:00 EDT 2019 | Cleveland, Ohio USA
Advanced Design & Manufacturing Cleveland
Career Center | Bedford, Texas USA | Sales/Marketing
Sell SMT/PCBA capital equipment in S.NJ, MD, PA, and DC area. Candidate will be calling on any potential account and focusing on two major established accounts there. Candidate should have a recent and significant succesful track record in selling
Career Center | , California USA | Sales/Marketing
$150-200K 1st years income - CEM Sales! DCSI is an International Executive Search Firm specializing in the CEM, OEM, & ODM industries with emphasis on Medical, Automotive, Design, Consumer, Telecom, and Industrial busines sectors. We currently have
Career Center | Savannah, Georgia USA | Engineering,Human Resources,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support
I’d like to give you a brief overview of my skills and experience. I am confident that I could bring value to the SMTnet as your Safety Professional. Here’s how my qualifications meet your requirements: • Military (E-7) Manager with experience as
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Heller Industries Inc. | https://hellerindustries.com/parts/448796-01/
448796-01 - Enhanced Rail ASSY, MD, 2043, CR Plated Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| https://www.feedersupplier.com/sale-13067781-mps1010-mx100-200-0201-nozzle-smt-nozzles.html
MPS1010 MX100 200 0201 Nozzle SMT Nozzles Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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