We provide X-ray inspection and BGA rework station ,for more information, contact Rita Li by : whatsapp 0086 134 3448 1030 Email;sales11@zhuomao.com.cn Seamark Zhuomao closed tube x-ray machine X-6600 for IGBT module inspection Product Appl
We provide X-ray inspection and BGA rework station ,for more information, contact Rita Li by : whatsapp 0086 134 3448 1030 Email;sales11@zhuomao.com.cn Seamark Zhuomao closed tube x-ray machine X-6600 for IGBT module inspection Product Appl
We provide X-ray inspection and BGA rework station ,for more information, contact Rita Li by : whatsapp 0086 134 3448 1030 Email;sales11@zhuomao.com.cn Seamark Zhuomao closed tube x-ray machine X-6600 for IGBT module inspection Product Appl
Product Application: X-Ray inspection is a method of non-destructive testing where many types of manufactured components can be examined to verify the internal structure via the penetration power from X-Ray. Seamark Zhuomao X-6600 X-ray inspection
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Seamark BGA chip welding inspection machine sealed tube x ray inspection X-5600 for quality inspection Product Application: X-Ray inspection is a method of non-destructive testing where many types of manufactured components can be examined to veri
We provide SMT x-ray chip counter, BGA rework station and customized X-ray solution, for more information, contact me by: whatsapp:0086 134 3448 1030 skype:ritaleeli Email:sales11@zhuomao.com.cn Seaamark Zhuomao 2D off-line x ray inspection equi
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Micor focus X-ray inspection , X-ray chip counter, Bga rework station, contact Rita Li by: Skype:ritaleeli whatsapp:0086 134 3448 1030 Email:sales11@zhuomao.com.cn Product Application: X-Ray inspection is a method of non-destructive testin
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
Industry News | 2008-01-04 11:15:56.0
January 2, 2008 - Lloyd Doyle Ltd., world leader in the supply of automatic optical test (AOT) and inspection systems for bare printed circuit boards, announces further installations of Automatic Optical Test equipment.
Industry News | 2019-11-05 22:21:39.0
Very often, customers ask details about what kind of testing do we use? How do we charge it? Do I have to pay every time or only for the first time? Is this testing safer and better than other one? etc In this blog, let's discuss the various kind of testing and their advantages and disadvantages. Some of them are mandatory, some of them are optional; Some of them are fast, some are slow; some of them are more reliable, and some not. Hope you will have a better understanding about various kinds testing and make better decision on your next PCB order.
