Full Site - : aoi for inner layer (Page 5 of 11)

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

Technical Library | 2011-10-06 13:59:04.0

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.

Cadence Design Systems, Inc.

Call for papers - EIPC Summer Conference

Industry News | 2008-02-04 11:15:15.0

The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.

European Institute of Printed Circuits-EIPC

Isola Introduces Ultra-Low Loss Materials for 100 Gigabit Ethernet Applications

Industry News | 2014-06-26 20:12:53.0

Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.

Isola Group

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Unicomp AX8200L X-ray with 1.5m LED Strip Inspection for Void Check

Industry News | 2021-05-21 03:56:59.0

LED lamp bead because of energy saving, low carbon environmental protection, no strobe, no radiation, high brightness, low heat advantages are gradually replacing the fluorescent lamp on the market, its application scope is expanding,although LED has many advantages, if the production or operation is not appropriate,there will be LED strip use fault phenomenon. LED lamp strip manufacturers also begin to pay more and more attention to the problem of production quality, then what equipment can be used for LED lamp strip backlight detection? Unicomp Technology here recommended AX8200L LED strip backlight detection equipment.

Unicomp Technology Co., Ltd

Productronica 2021 Messe Munchen - Most Popular Trade Fair for SMT and PCBA Electronics Assembly

Industry News | 2021-11-14 21:01:12.0

Productronica 2021 is an innovative, unrivaled, and international event. This is one of its kind of events that showcase the entire value chain in the production industry of electronic goods – from technology and components to software and services, including supply chain, Stencil Screen Printer, Pick & Placer, SPI, Reflow over, X-Ray inspection, BGA repair and maintenance. As an international trade fair, Productronica Munich 2021 covers the entire range of present and futuristic products, technologies, and system solutions.

Unicomp Technology Co., Ltd

Discover Viscom’s New 3D AOI Unit Designed for Production and Quality at SMTAI

Industry News | 2015-08-27 13:22:43.0

Viscom announced today that it will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Viscom’s applications experts will present the company’s new 3D AOI and CCI systems.

Viscom AG

Two Industry Awards for Viscom’s high-speed 3D AXI 7056-II at Nepcon China

Industry News | 2018-05-03 20:58:09.0

Viscom is very pleased to announce that their innovative high-speed 3D AXI inspection system X7056-II has been recognized with two significant industry awards at Nepcon China: the 2018 SMT China Vision Award and the EM Innovation Award.

Viscom AG

Saki Corporation's QDP System Provides Accuracy and Reliability for M2M Communication

Industry News | 2019-06-30 20:58:59.0

Saki Corporation will present how machine-to-machine (M2M) communication can be achieved by using an automated inspection system based on Quality Driven Production (QDP). The talk will be given at a Technical Workshop in Chonburi, Thailand, sponsored by Saki and Pillarhouse, at the new Saki Asia Pacific Demo Centre, DMG Mori Thailand, on July 3, 2019 from 9:00am-3:00pm. Participants will have the chance to try programming with Saki Self-Programming software and see M2M communication in action. Pillarhouse International Ltd., based in Essex, UK, is a leading force in the selective soldering industry.

Acroname

Saki Corporation Introduces Automated X-ray Inspection for IGBT Power Modules at Productronica Stand A2.259

Industry News | 2019-11-12 12:31:32.0

Expands Saki's Lineup of Compact, Lightweight, Ultra-High-Speed Inline 3D CT Automated X-ray Inspection Systems

SAKI America


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