25.0µm (>1 mil) Packing: Inner packing: vacuum packing/plastic bag Outer packing: standard carton packing Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 With UL, SGS and RoHS marks Special requirements: buried and blind via +
New Equipment | Assembly Services
The board is designed by customer and we did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surface: HASL Solder mask: Green
Electronics Forum | Fri Dec 12 01:06:02 EST 2003 | kenny
Dear folks; I am currently looking a PCB manufacturer who can fabricate PCB with the following specification:- Board sizes: _20000__ x _20000__ mils Thickness: 125 mils PCB material: FR4 Surface finish: 30 microinches Gold over 200 micro inches Nic
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | AOI / Automated Optical Inspection
CAL PIECE A E3622721000 for JUKI750 2050 E36117060A0B REEL HOOK 12 ASM. E3613706A00 REEL_PRESSER_12-56 E3614706A00 REEL SUPPORT SH COLLER E3614706AA0 REEL SUPPORT SH COLLER E3615706A00 REEL_BRAKE E36217210A0 CAL PIECE ASM. (730) E3622721000 C
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
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ASCEN Technology | https://www.ascen.ltd/Blog/mask_making_machine/732.html
： Automatic mask making machine, ：2020-07-29 Inner earloop mask making machine is mainly used for automatic forming of flat masks.After the entire roll of fabric is unrolled,it is driven by rollers,and the fabric is automatically folded and
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