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Essemtec to Define a New Standard - Paraquda is the world’s most advanced pick-and-place machine

Industry News | 2009-11-11 13:39:57.0

Paraquda is the newest SMD pick-and-place machine that Essemtec has introduced at the Productronica exhibition in Munich, Germany. The machine sets a new standard for flexible placement machines: Drive technologies, materials and software are state-of-the-art, machine operation is a user friendly and the application range is wider than ever before.

ESSEMTEC AG

Saki Corporation and Cogiscan Win Circuits Assembly's New Product Introduction Award for Electronics Assembly Production Software

Industry News | 2020-02-18 15:01:47.0

SAKI's software for inspection data analysis improves manufacturing quality and control

SAKI America

Lucky Number 8 Pick & Place Service Excellence Award for Europlacer.

Industry News | 2021-04-13 04:30:27.0

While the number eight is recognized as the luckiest number in China, it is now a lucky number for Europlacer, thanks to the company's unprecedented eighth consecutive Service Excellence Award win in the Pick & Place category from respected industry publication, Circuits Assembly. This year, the award ceremony took place online as coronavirus continues to alter the business landscape, but with the award highlighting exemplary customer service, it is as meaningful as ever.

EUROPLACER

Saki's Advanced Optical Inspection Boosts Quality Assurance at US-headquartered Smart Modular Technologies

Industry News | 2024-02-26 14:00:02.0

High-performance memory supplier chooses Saki's 3Si solder-paste inspection and 3Di inline AOI systems to handle miniaturization challenges and prepare for smart manufacturing.

SAKI America

Saki Self-Programming 3D Inspection Software is Fast, Easy, and Doesn't Require a Programmer

Industry News | 2018-08-14 17:57:21.0

Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.

SAKI America

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Industry News | 2017-09-20 15:08:48.0

Viscom AG today announced the adoption of the Valor® Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.

Viscom AG

Financial Times Recognizes Koh Young Technology as a FT500 High-Growth Company

Industry News | 2020-09-21 09:10:16.0

Atlanta, GA – Once again, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, was recognized by the Financial Times as a FT500 High-Growth Company (Asia-Pacific). Established in 2002, Koh Young Technology pioneered a new market by launching the worldʼs first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technique. Since then, we have become a global leader with our 3D measurement-based inspection equipment, as well as a solutions provider that performs a key role in quality management and process optimization for various industries. Based on this differentiated technological competitiveness, we have secured thousands of customers, while maintaining the largest global market share in the 3D SPI and 3D AOI markets.

Koh Young America, Inc.

CyberOptics Introduces the Industry’s First Design-to-Automated Inspection Data Flow Enabled by Mentor Graphics Valor Process Preparation

Industry News | 2013-12-09 11:53:14.0

CyberOptics Corporation (NASDAQ:CYBE) announces the close-to-immediate setup of PCBA inspection using Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems for new products in just one simple step.

CyberOptics Corporation

Vi TECHNOLOGY Brings a Complete 3D Inspection Solution to 3 Booths at NEPCON S China

Industry News | 2016-07-30 19:42:12.0

Vi TECHNOLOGY will exhibit with WKK (booth 1J55), American Tec (booth 1H40) and FTCL (booth 1H50) at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Vi TECHNOLOGY to Present Its Complete 3D Inspection Solution at SMTAI

Industry News | 2016-08-31 19:14:17.0

Vi TECHNOLOGY will exhibit in Booth #1019 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY


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