Electronics Forum | Fri Dec 12 01:06:02 EST 2003 | kenny
Dear folks; I am currently looking a PCB manufacturer who can fabricate PCB with the following specification:- Board sizes: _20000__ x _20000__ mils Thickness: 125 mils PCB material: FR4 Surface finish: 30 microinches Gold over 200 micro inches Nic
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon
| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t
Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX
Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release
Electronics Forum | Fri Jun 23 09:54:20 EDT 2000 | Dave F
Igmar: Chrys and JAX make good points. I'd like to add that you should be careful that you don't starve larger chip components of solder when using a 4 thou stencil.
Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea
My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
