Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Wed Nov 01 12:19:42 EST 2000 | Fraser
Steve, someone somewhere is feeding you a line!! if you increase the draft angle from || to / \ on your laser cut stencil you increase the surface area of the side wall and hence increase the likelyhood of the paste sticking in the aperture. Whats m
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
Electronics Forum | Sun Dec 08 23:40:19 EST 2002 | nonotalent
Hi all, We are currently having problems with > a laser-cut stencil that is electropolished and > nickel plated with 9-mil openings. The paste > does not release well from the apertures. We are > having to wipe after every print. The board is >
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup
| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Mon Jun 07 07:31:59 EDT 1999 | tannlin
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al Al I have a quote for you from one of the major CEM's "anyone who thinks they are controllin
