Electronics Forum | Mon Jun 07 07:31:59 EDT 1999 | tannlin
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al Al I have a quote for you from one of the major CEM's "anyone who thinks they are controllin
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Fri Jun 04 11:31:27 EDT 1999 | Tony
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Fri Feb 19 00:32:40 EST 1999 | ZEEK
| We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board ven
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Wed Jun 27 21:33:09 EDT 2001 | davef
There was a similar thread last week on SMTnet. Maybe the poster of that thread can help. Not everyone responds on-line. Check the SMTnet Archives for generalities and platitudes about PIH, although there may be some good links. Baring the obviou
