Electronics Forum | Mon Apr 16 09:13:16 EDT 2007 | pjc
Tombstone head and a graveyard mind. I would not recommend 1:1 due to solderpaste beed out opportunities. Have you tried the inverted home-plate? Here are some good links on tombstoning and how to eliminate it: http://www.aimsolder.com/technical_ar
Electronics Forum | Fri Sep 09 11:37:27 EDT 2005 | ???
Try home-plated the stencil apertures, and make "V" shape home-plated outside edges of two pads instead of between two pads.
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Fri Sep 09 14:03:06 EDT 2005 | Mei
Nomorely the V-shape home-plated apertures look like two opening mouth facing each other. But this time just opposite way. And make 30% home-plated. Hope you can understand.
Electronics Forum | Tue Aug 17 12:27:48 EDT 2010 | namruht
That reminds me...We already have home plate apertures on our stencil. Try number 2...I tried an overall reduction based on the copper layer of 10% and used oval apertures. I hope that you guys can suggest something that I am over looking. I know tha
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc
Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
Electronics Forum | Tue May 02 15:09:40 EDT 2006 | PWH
Just a few problems you might have to deal with: 1) Your bare boards must be clean and kept clean though-out the process. You could notice handling contamination that might otherwise have been removed in your wash. 2) You will see solder balls a
