Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson
As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur
Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG
Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Mon Jul 30 18:52:43 EDT 2001 | Brian W.
You did not provide the stencil thickness or your aspect ratio. If your aspect ratio (Aperture width/stencil thickness) is less than 1.5, the paste will not release correctly from the aperture, leaving paste in the aperture. For example, if your pa
Electronics Forum | Thu Apr 01 16:47:23 EST 1999 | AlexO
Dan, The rationale to use laser cut stencils in my experience is based on the benefits to paste release. Laser cut stencils are "supposed" to have a smoother inner aperture wall. That, combined with the trapezoidal shape (which can be emulated with
Electronics Forum | Wed Aug 01 13:35:41 EDT 2018 | tey422
Need all your experts out there for tips & tricks to make things work. I been giving a task to help redesign a simple board; only to load two components. The challenge is to use pick-n-place machine to load the coil onto the 50up array panel. Previou
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Tue Sep 18 13:21:06 EDT 2001 | fcouture
Hello Jeff, I found some good information from what I read until now...so thank you! I have two questions: 1) What finish did you use on the PCB for 0201 ? I think with an aperture so small (12x15mils) tin plated is impossible, what do you think
Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
