Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower
Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently
Electronics Forum | Thu May 11 18:24:12 EDT 2000 | Micah Newcomb
placement is only ok?, what size chip is this? Is the pad spacing correct? Are the apertures on your stencil reduced or 1:1. Stencil thickness? Do the problem areas heat up evenly? special plating on terminals of cap? Need more info.
Electronics Forum | Wed Aug 01 06:52:25 EDT 2001 | Mark
please look at trying lazer cut stencils. They have trapozoidal shaped apertures and this could assist with the paste releasing onto y the PCB
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Wed Nov 05 08:49:39 EST 2003 | Axl
You might want to try reducing your stencil aperture by 10% first off; if it still swims try using a home plate design. Also if your profile is going into liquidous to fast, this might cause the swimming as well, check your profile.
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Tue Jul 31 00:48:55 EDT 2001 | Frank
Sorry I forgot to provide enough information. Stencil thickness is 6 mil Aperture width is 10 mil Aspect ratio (aperture area / wall area) = 0.72 Solder paste mesh size, type 3 (-325 +500) With this aspect ratio we can printing without any probl
Electronics Forum | Sat Jun 23 08:29:04 EDT 2001 | davef
Well, at least I don�t feel so bad that we�re not the only ones going anal on this blankin� cap thing. We�re gunna change process on ever effin wave soldered SMT cap!!! I�m going to off myself!!!! And in about 15 seconds, some doodoo brain is goin
