Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Aug 28 11:14:46 EDT 1998 | Justin Medernach
| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa
Electronics Forum | Fri Dec 01 15:06:54 EST 2017 | emeto
I am not sure that is doable. Ground Aperture is very small(for the stencil blade to get in there) and very close to the other apertures. I want to say the minimum requirement for step is 6mm clearance from other apertures for the stencil houses that
Electronics Forum | Fri Apr 21 12:43:51 EDT 2000 | David
We are going to hand place through hole connectors by screening them top side in a double sided reflow board. I saw this done before sucessfully on a daily basis but is there anyone with a paper or specs as to what aperture size, any special pad cons
Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Fri Dec 01 13:55:44 EST 2017 | emeto
Brikainis, it looks like these vias are not plated and closed. I would say that thickness of your paste is lifting the part. Are you willing to try another stencil with ground pad apertures matching the via holes? It is probably worth trying. Anothe
Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Fri Jul 10 10:40:13 EDT 1998 | Todd N
Hi all, We are currently having problems with a laser-cut stencil that is electropolished and nickel plated with 9-mil openings. The paste does not release well from the apertures. We are having to wipe after every print. The board is fixtured well a
