New Equipment | Cleaning Equipment
The Low-cost / Compact Stencil Cleaners Heated wash for cleaning lead-free solder paste, pallets and adhesives 100% Stainless steel construction Two model sizes to conserve energy, use less chemistry and generate less waste Install i
Industry News | 2008-07-22 13:24:53.0
Starting at less than $8000...and it's a Smart Sonic!
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
New Equipment | Solder Paste Stencils
Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste
Industry News | 2019-05-22 11:33:05.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2019-05-22 11:33:07.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2009-04-21 13:58:29.0
TORRANCE, CA � April 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Toronto Tabletop Exhibition, scheduled to take place May 20-21, 2009 at the Crowne Plaza in Toronto, ON.
Industry Directory | Distributor / Manufacturer
AOI Vision is the specialized supplier of advanced materials and engineering solutions for SMT PCB screen printing industry. We team up with industry leaders who are equipped with cutting edge technology and innovative products.
