Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Industry News | 2015-01-29 13:21:00.0
FCT Assembly is pleased to announce the 20th anniversary of the Fine Line Stencil division. Shortly after FCT Assembly was established in 2004, Fine Line Stencil was acquired.
Industry News | 2011-01-31 22:19:11.0
FCT Assembly is pleased to introduce the new UltraSlic™ Stencil with Nano-Coating. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.
Industry News | 2015-05-24 10:37:43.0
Having produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow we believe we are in a good position to help engineers achieve better yields and implement high and low temperature processes with our next PIHR webinar http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129
Industry News | 2010-11-06 17:45:03.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its latest environmentally responsible cleaning solutions at the upcoming High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.
Industry News | 2010-03-30 13:51:24.0
COLORADO SPRINGS, CO - FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, to feature industry leading stencils and services in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2013-09-13 13:53:44.0
FCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Industry News | 2008-07-30 20:42:23.0
GREELEY, CO � July 30, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, premiers WS170 water soluble solder paste.
