Industry News | 2013-02-20 08:38:42.0
FCT Assembly announces that it has been awarded a 2013 NPI Award in the category of Coatings/Encapsulants for its NanoSlic™ Nano Coating.
Industry News | 2014-02-28 15:48:17.0
FCT Assembly today announced plans to exhibit at the SMTA Dallas and SMTA Houston Expos. The SMTA Dallas Expo is scheduled to take place March 4, 2014 at the Plano Center in Plano, TX, and the SMTA Houston Expo will take place March 6, 2014 at the Stafford Centre in Stafford, TX.
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2014-07-14 06:48:21.0
unced that it will exhibit at the Ohio SMTA Expo & Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland – Independence.
Industry News | 2008-02-28 15:03:16.0
Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.
New Equipment | Solder Materials
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils and related products in the industry. Fine Line Stencils highly-polished PrintMaster and Slic-Blade nickel squeegee blades offer impro
Technical Library | 2023-05-22 16:42:56.0
Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
Industry News | 2013-03-12 16:26:29.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Dallas and Houston Expo & Tech Forums.
