NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
Technical Library | 2022-08-17 01:21:54.0
Back in the "good old days," stencil cleaning was effortless and effective. CFC-based solvents were sprayed or wiped onto a stencil with apertures hundreds of times larger than modern-day components. The stencil cleaning process was not considered a value-added procedure; instead it was the cleaning of a production tool. How times have changed. The late-1980s ushered in the end of most of the popular solvents, and the machines that consumed them. Assemblers turned to alternative cleaning agents, including IPAs and other solvents.
Technical Library | 2023-05-22 16:42:56.0
Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2015-12-10 17:59:21.0
Metal Etch Services has more than 25 years experience manufacturing High Quality SMT Stencils, based on this experience we offer free technical assistance to all our customers.
Industry News | 2001-08-02 12:48:27.0
Inspect stencils & screens for accuracy, cleanliness, damage, distortion and create Gerber data.