Industry News | 2014-02-13 16:26:07.0
Gen3 Systems Limited today announced that they will exhibit at National Electronics Week (NEW) ADEC Expo South Africa, scheduled to take place March 11-12, 2014 at the Gallagher Convention Centre in Midrand, Johannesburg. Quamba Technologies, Gen3’s South African Distributor, will be exhibiting alongside Gen3 and will be displaying the European Product of the Year, the Gensonic Stencil Cleaning system.
Used SMT Equipment | Screen Printers
MPM Accela Screen printer (2005) Brand: MPM Model: Accela Year: 2005 Serial #: AC02020 Type: Screen printer Machine specifications: Windows XP Operating System Benchmark™ Software SPC Data Collection Closed-Loop Squeegee Head CANo
Industry News | 2009-04-21 13:58:29.0
TORRANCE, CA � April 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Toronto Tabletop Exhibition, scheduled to take place May 20-21, 2009 at the Crowne Plaza in Toronto, ON.
Industry News | 2014-02-18 17:14:55.0
FCT Assembly will debut the new NanoSlic® Gold stencil in Booth #2175 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-08-25 16:35:50.0
FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2013-05-11 22:01:39.0
The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
Industry News | 2018-05-11 00:14:10.0
Laser Stencil with different size. Framed or frameless available.
Custom libraries for automated aperture modifications Special cutting routines One-click data matrix code or barcode generation for stencil marking Fast Setup: Loose Foils and Framed Stencils The LPKF StencilLaser G 6080 automatically ad
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2018-11-06 12:42:25.0
Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect
