Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Career Center | Lumberton, New Jersey USA | Engineering
Reports to: Cad/Laser Manager Department: Cad Location: Lumberton Phone: 609-261-2670 Ask for Greg Starrett Email: Send resume as a word document or PDF to greg@metassocs.com Job Summary: Under the general supervision of the Cad Manager
The Mounter Nozzle Cleaner cleans 20 nozzles at a time. With the system, ultrasonically-vibrated water thoroughly passes through every nozzle opening. Double-cleaning power is generated with ultrasonic-energy cleaning and simultaneous vacuum suction.
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All types of scanning, film, aperture cards, engineering size paper. Papaer to Cad Perfect conversions.
All types of scanning, film, aperture cards, engineering size paper. Papaer to Cad Perfect conversions.
New Equipment | Cleaning Equipment
Gensonic Ultr-Sanic hand-held stencil cleaning Kit Compact and portable 2-3 minute cleaning cycle Cleans all solder pastes
JUKI High Precision Solder Paste Printer RP-2 with high precision Details Images Features Auto solder paste replenishment system The solder paste is automatically dispensed across the entire squeegee length, maintaining at 15 mm rolling diame
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
