Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Used SMT Equipment | Screen Printers
The MPM Accela printer from Speedline is the ultimate printing solution for manufacturers of high-volume, high-technology applications. Accela processes the largest, thinnest or most complex substrates with unprecedented speed, accuracy and ease. *
Used SMT Equipment | Screen Printers
Grid-Lok Tooling is the most flexible PCB support on the SMT market, for the entire assembly process. This unique concept combines the benefits of manual locking modules with the extensive advantages of automatic tooling systems. Easy upgradeability
Industry News | 2012-12-03 16:09:15.0
LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.
New Equipment | Solder Paste Stencils
Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste
New Equipment | Solder Paste Stencils
Fine Line introduces our Slic™ laser cut stencil. The Slic™ material has been proven to outperform the industry standard stainless steel material. Slic™ has the mechanical and thermal properties of industry standard stainless steel, yet offers superi
The ScreenCut laser stencil cutting system features fast design file conversion and is compatible with Gerber, DFX and other format designs. Set-up and changeover for loose foil or frame mounted material is extremely fast as is throughput - up to an
Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture wave solder carriers for open aperture and selective soldering process. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
