Industry News | 2021-01-22 11:33:33.0
It's great to be back at IPC APEX 2021 albeit online to meet and discuss process and production issues with engineers from around the globe. It's been a while, but having presented many education classes and special features at IPC APEX in San Diego, Las Vegas plus Anaheim it's good to have the opportunity to participate online this year https://youtu.be/NTCYU5bz-qQ
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
Industry News | 2017-02-08 17:57:50.0
Data I/O Corporation will showcase the new ConneXTM smart programming software for PSV systems in Booth #2741 at the IPC APEX EXPO, scheduled to take place February 14th – 16th at the San Diego Convention Center in San Diego, CA.
Industry News | 2019-01-04 16:19:27.0
Data I/O Corporation will showcase the PSV7000, PSV5000, Lumen®X programming platform with Universal Flash Storage (UFS) programming and the ConneX® software in Booth #2015 at the IPC APEX Expo, scheduled to take place January 29th – January 31st at the San Diego Convention Center in San Diego, CA.
Industry News | 2019-01-15 10:01:12.0
Seoul, South Korea – As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX Expo during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at Booth 1908 in the San Diego Convention Center.
Industry News | 2021-12-21 15:06:19.0
KIC will exhibit in booth 3009 and the Factory of the Future Pavilion at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022, at the San Diego Convention Center San Diego, CA. The KIC team are thermal process experts who make ovens smarter. Along with award-winning Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and their complete ecosystem of solutions for thermal processes.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2013-01-19 05:42:49.0
Through Mould Via (TMV) is referred to as a second generation package on package device developed by AMKOR and incorporated into many of the leading mobile devices. The process of assembly provides some challenges event to those using the traditional PoP devices.
Industry News | 2013-02-12 12:25:53.0
MYDATAis scheduled to release new models of its popular SMD Tower for compact storage of electronics manufacturing components.
Industry News | 2018-03-22 20:49:36.0
Last month, representatives from Reed Exhibitions made the journey to IPC APEX Expo in San Diego, CA, where they hosted an exclusive luncheon for Mexican reps, press and industry leaders.
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