Industry News | 2019-01-05 16:26:04.0
SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
Industry News | 2022-01-10 16:49:36.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Industry News | 2015-01-22 18:18:14.0
Data I/O Corporation announced today that it will feature the PSV7000 automated programming system in Booth #2839 at the IPC APEX Expo, scheduled to take place February 24-26, 2014 at the San Diego Convention Center in San Diego, California.
Industry News | 2017-01-10 14:55:25.0
Data I/O Corporation will showcase the PSV7000 with process control software solutions to meet demanding requirements from Automotive and Internet-of-Things applications in Booth #2741 at the IPC APEX EXPO, scheduled to take place February 14th – 16th at the San Diego Convention Center in San Diego, CA.
Industry News | 2018-12-18 08:23:17.0
Seoul, South Korea – As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how Artificial Intelligence-based solutions and machine learning offers more consistent inspection at the IPC APEX Expo during 29–31 January 2019 in San Diego, California. With the ongoing trend of Industry 4.0, Koh Young has begun unblocking the potential of Artificial Intelligence (AI) to improve throughput and production quality in several ways. The company will display an array of innovative solutions powered by AI at Booth 1908 in San Diego Convention Center.
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2022-12-21 10:42:04.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2013-01-14 17:35:33.0
ACD, will exhibit in Booth #817 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Industry News | 2013-02-14 11:48:46.0
MYDATA, maker of the popular SMD Tower for compact storage of electronics manufacturing components, hasannounced a new feature allowing for automated storage of loaded Agilis feeders in their entire range of tower models
Industry News | 2015-01-13 11:54:43.0
Indium Corporation's Eric Bastow, assistant technical manager, will present at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Bastow's presentation, Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?, explores the electrical reliability of two no-clean solder pastes stored under various conditions and aged over different time intervals.
