Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
Used SMT Equipment | Pick and Place/Feeders
FX-3RAL High-Speed Modular Mounter ■ Chip components 90,000CPH (0.040 seconds/chip, good conditions) 66,000CPH: Chip (according to IPC9850 standard) ■ 0402 chip～33.5mm square element ■ Laser recognition: ±0.05mm
About more detail for the PCB destacker check the link? https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html PCB destacker/PCB bare board unloader unloading bare board to replace the PCB magazine unloader machine for the PCB bar
Industry News | 2015-04-06 12:45:50.0
Count On Tools today announced they will display an array of products in the Adopt SMT booth, Hall 7-100, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg, Germany.
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0610/157.html http://www.pcb-separator.com/ PCB Separator supplier/PCB Separator factory/pcb cutting machine manufacturer/pcb depaneling tool/V-cut pcb separator/LED strip cutter
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/137.html ?????????/V-cut depaneling/PCB Depanelers/??pcb????/PCB cutting machine/pcb depaneling machine/depanelizing pcb
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
.gif)
winsouce.jpg)