Industry Directory | Consultant / Service Provider
As a leader in electronic design automation (EDA) and semiconductor intellectual property (IP), Synopsys delivers products and services that accelerate innovation in the global electronics market.
Industry Directory | Consultant / Service Provider
An industry leader in high quality PCB Layout Design and PCB CAM Front End Engineering Services offering you the very best service at very competitive prices.
Hanwha SM471 Plus pick and place machine Component Range:0402(01005 Patch speed 78,000 CPH 2 Gantry x 10 Spindles/Head weight 1820KG Product description: Hanwha SM471 Plus Pick and Place Machine,Component Range:0402 above, Patch speed 78,000 CPH,2 G
New Equipment | Tape and Reel Equipment
Full-automatic taping machine 1. This equipment is a vibrating plate feeding, equipped with automatic feeding silo. 2. Optional CCD visual inspection system can be used to identify defects and directions on each surface of the material by using mu
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Used SMT Equipment | Flexible Mounters
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Parts & Supplies | Pick and Place/Feeders
Device name: JUKI FX-1, JUKI FX-1 slider, used JUKI FX-1 slider Equipment Profile JUKI FX-1 high-speed patch machine Product Model: JUKI FX-1 not only inherits the traditional concept of modular mount machine, but also realizes a high-speed mount
Parts & Supplies | SMT Equipment
Juki 2050 2060 503 504 nozzle Description: Brand:JUKI Nozzle model:500 501 502 503 504 505 506 507 508 Application:Juki 2050 2060 smt machine Customize:yes Advantage: 1.The juki nozzle core is different, it suitable for RC, varicap, SOT, QFN
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
About more detail for the PCB destacker check the link? https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html PCB destacker/PCB bare board unloader unloading bare board to replace the PCB magazine unloader machine for the PCB bar
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Wed Apr 19 00:00:00 EDT 2017 - Fri Apr 21 00:00:00 EDT 2017 | Nara, Japan
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2017)
International Microelectronics Assembly and Packaging Society (IMAPS)
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Cabuyao,, Laguna Philippines | Engineering,Maintenance,Production,Technical Support
�X 10 years experience in SMT field of manufacturing company,knowledge in GC-Powerplace software. �X Knowledge in programming and operating Modular/Turret Machine in Surface Mount Technology and Flipchip technology. �X Expertise in the field of SMT m
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
Imagineering, Inc. | https://www.pcbnet.com/blog/drones-the-next-frontier-for-printed-circuit-boards/
. The adoption of drones by a multitude of industries is making them a lucrative target as they are an emergent technology, far from mature
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/corporate-governance/share-ownership-guidelines
, within five years of the date of adoption. Likewise, newly elected or promoted executive officers will have up to five years to meet the applicable ownership requirements after their election or promotion, or in the case of executive officers
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