Full Site - : application engineers (Page 3 of 562)

parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

SMTnet

GPS Receiver Shrinks to Surface Mounting

Industry News | 2003-03-18 10:12:41.0

The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.

SMTnet

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

Optical MEMS Finding Greater Opportunities in Non-Telecom Products

Industry News | 2003-07-02 09:35:30.0

As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.

SMTnet

RSI's eSight Design for Manufacturability Solution Lowers PCB Manufacturing and Implementation Costs

Industry News | 2003-02-13 08:11:45.0

eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%

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Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

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MIRTEC RECEIVES A GLOBAL TECHNOLOGY AWARD FOR ITS MV-9XP LED PACKAGE INSPECTION SYSTEM

Industry News | 2013-11-13 12:39:14.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.

MIRTEC Corp

Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

MIRTEC RECEIVES TWO PRESTIGIOUS AWARDS AT APEX 2016

Industry News | 2016-03-18 10:45:49.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it received two awards at the 2016 IPC APEX EXPO. MIRTEC’s MV-6 OMNI 3D AOI system was recognized with a 2016 New Product Introduction (NPI) Award in the category of Test & Inspection – AOI. Additionally, MIRTEC received the prestigious 2016 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the awards to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center.

MIRTEC Corp

XEMICS' New 433MHz and 868MHz ETSI/FCC Compliant RF Modules

Industry News | 2003-05-22 08:14:29.0

RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module

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