Industry News | 2021-10-29 21:16:15.0
One of the most successful energy management tools ever used in HVAC (Heating, Ventilating and Air Conditioning) systems of buildings is the Variable Frequency Drive (VFD).Over the past 20 years, VFD has been successfully installed on fan and pump motors in a variety of variable load applications. The saved energy is up to 35% to 50% compared with using traditional constant-speed applications. And the investment return period is 6 months to 2 years.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Industry News | 2016-06-19 19:34:40.0
Pickering Interfaces will showcase their broad catalog of PXI switching and simulation and Ethernet LXI switching solutions at SEMICON West booth 5877 on July 12-14 in San Francisco, CA. These products include Pickering’s High-density LXI Matrix Modules, High-Density PXI Relays Modules, PXI RF Multiplexers, PXI Battery Simulators, and PXI & LXI Chassis
Industry News | 2016-08-08 07:51:43.0
Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016 in booth 822 on September 20-22, 2016.
Fully automatic wire crimping machines for high-speed wire processing. High productivity, short changeover times, user-friendly operation and a wide range of processing capabilities from wire and cable cutting, stripping and crimping to sealing, twis
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
Industry News | 2017-12-12 19:05:18.0
ECT switch probes are cost effective and reliable solutions for non-destructive testing to verify the presence of components or contact leads within a connector assembly. ECT offers proven off-the-shelf options and a large portfolio of custom switch probes. ECT’s experience and design standards combined with its knowledge of materials and platings allows for the quick alignment of probe features with project requirements. ECT switch probes are replaceable by using of one of many receptacle termination options. Customers can choose from gold or nickel plated plungers.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2003-03-10 17:51:59.0
TiNiMIGHT Technology
Industry News | 2021-05-11 15:02:31.0
New Yorker Electronics Releases Exxelia Ohmcraft HVD Resistor Series with Voltage Ratings to 40kV and Resistance Values to 2TΩ
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