Industry News | 2015-04-07 15:42:29.0
Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.
Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
Industry News | 2021-06-08 03:45:26.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Industry News | 2022-08-26 09:15:23.0
SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.
Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2016-02-03 12:04:47.0
The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.
Industry News | 2018-04-25 19:59:52.0
generation of solutions, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. Joining the The Next> series of test systems, first previewed last year at productronica will be Viva 6 Next>, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program.
Industry News | 2018-06-24 07:46:24.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.
Industry News | 2018-07-02 21:34:21.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.
